Plessey and Axus Technology, the provider of CMP, wafer thinning and wafer polishing surface-processing machines, are collaborating to bring GaN-on-Silicon monolithic microLED technology to market.
Plessey is boosting its microLED display manufacturing capabilities with the purchase of metal and oxide chemical mechanical polishing (CMP) and associated tools from Axus to enable the wafer-scale bonding of microLED wafers to CMOS backplanes.
A number of Axus CMP and Scrubber systems have been deployed to enable critical wafer planarisationand preparation for wafer-scale bonding.